盛群無鉛產品的「可靠度試驗」結果

以下兩種封裝型式之純錫(Matte Tin plating, i.e. Pure Sn plating)電鍍成品均已通過可靠度試驗，測試項目與結果如下：(SOT-25之試驗結果依SOT-89報告，可適用)

測式項目
封裝型式
Precondition TCT PCT Solderability
SOT-89 PASS PASS PASS PASS
TO-92 N/A PASS PASS PASS
SOP系列 PASS PASS PASS PASS
DIP系列 N/A PASS PASS PASS
QFP系列 PASS PASS PASS PASS
QFN系列 PASS PASS PASS PASS

可靠度的測試條件如下：

No. Test Item Sample Size Accept/Reject LTPD% Reference Test Condition
1 Precondition 55 1/2 7% A113-A
J-STD-020C
Level 3 		TCT:-65℃~150℃, 5cyclesBaking: 125℃, 24hrsSoaking: 30℃/60%RH, 192hrsIR Reflow:260℃(-5, 0), 3cycles
2 Temperature Cycling Test(TCT: Air to Air) 55 1/2 7% MIL-STD-883E
1010.7 		-65 ℃ ~ 150 ℃(10min 10min)
100 Cycles
3 Pressure Cook Test ( PCT ) 55 1/2 7% JEDEC-A121 Ta=121℃,100%RH , 168Hrs,15psig(2atm)
4 Solderability 10 0/1 - MIL-STD-883E
M2003 		1. Steam Age 8hrs

2. 245℃+-5℃, 5sec

5 Whisker(R.T.) 5 0/1 - HOLTEK SPEC 25±5℃, 30~80%RH1000Hrs
　 Whisker(R.T.) 5 0/1 - HOLTEK SPEC 60±5℃, 90±5%%RH1000Hrs

J-STD-020-C標準迴焊溫度曲線如下：

SOT-89實際實驗之迴焊溫度曲線如下

詳細之可靠度之試驗報告

JEDEC Standard Spec : J-STD-020-C